Baker Hughes - Thermal Analysis

Fluctuations, Convection, Conduction, and Radiation

Typically, within our enclosure development process our engineering team is tasked with simulating performance of a drive in varying operating environments. Acertech uses thermal analysis to measure the effects of temperature fluctuations on a design. AcerTech can also analyze heat transfer which is analyzed by means of conduction (in which case we use FEA) or convection and radiation (in which case we use CFD software to investigate the heat transfer. Without having to build, test, and destroy an expensive drive prototype, analysis can investigate design changes and validate decisions early in the development process. Our skilled engineering team uses FEA to save time and money with a thermal analysis.

Project Features

• Finite Element Analysis (FEA)
• Computational Fluid Dynamics (CFD)
• Simulation Based Testing